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19-3266; Rev 2; 12/04
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
General Description
The MAX13013/MAX13014/MAX3023 single-/dual-/quadlevel translators provide the level shifting necessary to allow 100Mbps data transfer in a multivoltage system. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. Logic signals present on the VL side of the device appear as a higher voltage logic signal on the VCC side of the device, and viceversa. The MAX13013 single-, the MAX13014 dual-, and the MAX3023 (UCSPTM package) quad-level translators feature an enable (EN) input. The MAX3023 (TSSOP package) quad-level translator features EN and EN inputs. When disabled, each device places all inputs/outputs on both sides in tri-state and reduces the VCC supply current to 0.03A, and the VL supply current to 0.1A. These devices operate at a guaranteed 100Mbps data rate for VL > 1.8V. The MAX13013/MAX13014/MAX3023 accept a +1.65V to +3.6V VCC voltage and a +1.2V to (VCC - 0.4V) VL voltage, making them ideal for data transfer between low-voltage ASICs/programmable logic devices (PLDs) and higher voltage systems. The MAX13013 is available in 3 x 2 UCSP and 6-pin SC70 packages. The MAX13014 is available in 3 x 3 UCSP and 8-pin SOT23 packages. The MAX3023 is available in 4 x 3 UCSP and 14-pin TSSOP packages. All devices operate over the extended -40C to +85C temperature range.
Features
100Mbps Guaranteed Data Rate Bidirectional Level Translation MAX13013 (Single) MAX13014 (Dual) MAX3023 (Quad) VL Operation Down to +1.2V Ultra-Low 0.1A Supply Current When Disabled Low-Quiescent Current (0.1A) UCSP, SC70, SOT23, and TSSOP Packages
MAX13013/MAX13014/MAX3023
Pin Configurations
TOP VIEW
VCC 1 6 EN A VCC GND 2 I/O VCC1 GND 1 2 3
MAX13013
5
VL B
MAX13013
VL I/O VL1 EN
I/O VCC1 3
4
I/O VL1
SC70
3 x 2 UCSP TOP VIEW (BUMPS ON BOTTOM OF DIE)
Typical Operating Circuit
+1.8V 0.1F 0.1F +3.3V
Applications
CMOS Logic-Level Translation Low-Voltage ASIC Level Translation Cell Phones SPITM, MICROWIRETM Level Translation Portable POS Systems Portable Communication Devices GPS Telecommunications Equipment
+1.8V SYSTEM CONTROLLER CLK DATA GND
VL
VCC
+3.3V SYSTEM
MAX13014
I/O VL1 I/O VL2 I/O VCC1 I/O VCC2 GND CLK DATA GND
Ordering Information/Selector Guide
PART MAX13013EXT TEMP RANGE -40C to +85C PIN-PACKAGE 6 SC70 PACKAGE CODE -- TOP MARK ACD NUMBER OF VL VCC TRANSLATORS 1 Number of VCC VL TRANSLATORS 1 EN EN --
MICROWIRE is a trademark of National Semiconductor Corp. SPI is a trademark of Motorola, Inc. UCSP is a trademark of Maxim Integrated Products, Inc.
Pin Configurations continued at end of data sheet. Ordering Information/Selector Guide continued at end of data sheet. 1
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013/MAX13014/MAX3023
ABSOLUTE MAXIMUM RATINGS
All voltages are referenced to GND. VCC ...........................................................................-0.3V to +4V VL...........................................................................................-0.3V to +4V I/O VCC_......................................................-0.3V to (VCC + 0.3V) I/O VL_ ...........................................................-0.3V to (VL + 0.3V) EN, EN...........................................................-0.3V to (VL + 0.3V) Short-Circuit Duration I/O VL_, I/O VCC_ to GND ....................................................Continuous Continuous Power Dissipation (TA = +70C) 6-Pin SC70 (derate 3.1mW/C above +70C) ..............245mW 6-Bump UCSP (derate 3.9mW/C above +70C).........308mW 8-Bump UCSP (derate 4.7mW/C above +70C).........379mW 8-Pin SOT23 (derate 9.1mW/C above +70C)............727mW 12-Bump UCSP (derate 6.5mW/C above +70C) ...518.8mW 14-Pin TSSOP (derate 9.1mW/C above +70C) .........727mW Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range ............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +1.65V to +3.6V, VL = +1.2V to (VCC - 0.4V), EN = VL, EN = open (MAX3023 TSSOP package only), CIOVL 15pF, CIOVCC 40pF, TA = TMIN to TMAX. Typical values are at TA = +25C.) (Notes 1, 2)
PARAMETER POWER SUPPLY VL Supply Range VCC Supply Range Supply Current from VCC VL VCC IQVCC I/O VCC_ = 0, I/O VL_ = 0 or I/O VCC_ = VCC, I/O VL_ = VL I/O VCC_ = 0, I/O VL_ = 0 or I/O VCC_ = VCC, I/O VL_ = VL Supply Current from VL IQVL I/O VCC_ = 0, I/O VL_ = 0 or I/O VCC_ = VCC, I/O VL_ = VL, VL < VCC - 0.2V TA = +25C, EN = 0 TA = +25C, EN = 0 TA = +25C, EN = 0, VL = VCC - 0.2V TA = +25C, EN = 0 ITS-VL TA = +25C, EN = 0, VL = VCC - 0.2V TA = +25C, EN = 0 TA = +25C, EN = 0, VL = VCC - 0.2V 55 74 0.15 20 A 1.2 1.65 0.1 0.2 VCC - 0.4 3.60 1 2 A 10 100 V V A SYMBOL CONDITIONS MIN TYP MAX UNITS
VCC Tri-state Output-Mode Supply Current VL Tri-state Output-Mode Supply Current (MAX13013/MAX13014) VL Tri-state Output-Mode Supply Current (MAX3023 TSSOP Package Only) I/O Tri-state Output-Mode Leakage Current
ITS-VCC ITS-VL
0.03 0.1 1 50
1 0.2 2 70
A A
A
2
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+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +1.65V to +3.6V, VL = +1.2V to (VCC - 0.4V), EN = VL, EN = open (MAX3023 TSSOP package only), CIOVL 15pF, CIOVCC 40pF, TA = TMIN to TMAX. Typical values are at TA = +25C.) (Notes 1, 2)
PARAMETER LOGIC-LEVEL THRESHOLDS I/O VL_ Input-Voltage High I/O VL_ Input-Voltage Low Pullup Resistance on I/O VL_ Pulldown Resistance on I/O VL_ I/O VCC_ Input-Voltage High I/O VCC_ Input-Voltage Low Pullup Resistance on I/O VCC_ Pulldown Resistance on I/O VCC_ EN, EN Input-Voltage High EN, EN Input-Voltage Low EN Input Current Pullup Resistance on EN Pulldown Resistance on EN I/O VL_ Output-Voltage High I/O VL_ Output-Voltage Low I/O VCC_ Output-Voltage High I/O VCC_ Output-Voltage Low VOHL VOLL VOHC VOLC VIH VIL MAX13013/MAX13014 MAX3023 MAX3023, TSSOP package only I/O VL source current = 20A I/O VL sink current = 20A I/O VCC source current = 20A I/O VCC sink current = 20A 2/3 x VCC 1/3 x VCC -5 46 46 2/3 x VL 1/3 x VL 62 62 VIHC VILC 2.5 2.5 2/3 x VL 1/3 x VL +5 81 81 VIHL VILL 120 75 2/3 x VCC 1/3 x VCC 2/3 x VL 1/3 x VL V V V V k k V V A k k V V V V SYMBOL CONDITIONS MIN TYP MAX UNITS
MAX13013/MAX13014/MAX3023
_______________________________________________________________________________________
3
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013/MAX13014/MAX3023
TIMING CHARACTERISTICS
(VCC = +1.65V to +3.6V, VL = +1.2V to (VCC - 0.4V), EN = VL, EN = open (MAX3023 TSSOP package only), CIOVL 15pF, CIOVCC 40pF, TA = TMIN to TMAX. Typical values are at TA = +25C.) (Notes 1, 2)
PARAMETER I/O VCC_ Rise Time SYMBOL tRVCC CONDITIONS CIOVCC = 15pF, Figure 1 CIOVCC = 20pF, Figure 1 CIOVCC = 40pF, Figure 1 CIOVCC = 15pF, Figure 1 I/O VCC_ Fall Time I/O VCC_ One-Shot Output Impedance I/O VL_ Rise Time I/O VL_ Fall Time I/O VL_ One-Shot Output Impedance Propagation Delay, Driving I/O VL_ Propagation Delay, Driving I/O VCC_ Part-to-Part Skew (Note 3) Propagation Delay from I/O VL_ to I/O VCC_ after Enable Propagation Delay from I/O VCC_ to I/O VL_ after Enable Maximum Data Rate I/OVL-VCC CIOVCC = 15pF, Figure 1 I/OVCC-VL CIOVL = 15pF, Figure 2 tPPSKEW tEN-VCC tEN-VL CIOVCC = 15pF, CIOVL = 15pF, VCC = 2.5V, VL = 1.8V CIOVCC = 15pF, Figure 3 CIOVL = 15pF, Figure 4 CIOVCC = 15pF, CIOVL = 15pF, VL > 1.8V CIOVCC = 15pF, CIOVL = 15pF, VL > 1.2V 100 80 tRVL tFVL CIOVL = 15pF, Figure 2 CIOVL = 15pF, Figure 2 tFVCC CIOVCC = 20pF, Figure 1 CIOVCC = 40pF, Figure 1 MIN TYP MAX 2.5 3 4 2.5 3 4 18.5 2.5 2.5 12.5 6.5 6 4 1000 1000 ns ns ns ns ns ns ns Mbps ns ns UNITS
Note 1: VL must be less than or equal to VCC - 0.4V during normal operation. However, VL can be greater than VCC during startup and shutdown conditions. Note 2: All units are 100% production tested at TA = +25C. Limits over the operating temperature range are guaranteed by design and not production tested. Note 3: Not production tested. Guaranteed by design.
4
_______________________________________________________________________________________
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
Typical Operating Characteristics
(Data rate = 100Mbps, VCC = 3.3V, VL = 1.8V, TA = +25C, unless otherwise noted.)
MAX13013/MAX13014/MAX3023
VL SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX13013 toc01
VL SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX13013 toc02
VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX13013 toc03
1.0
0.6 0.5 VL SUPPLY CURRENT (mA) 0.4 0.3 0.2 0.1 0 DRIVING I/O VL_ VL = 1.2V CIOVCC = 15pF 1.5 2.0 2.5 3.0 3.5
25
VCC SUPPLY CURRENT (mA)
VL SUPPLY CURRENT (mA)
0.8
20
0.6
15
0.4 DRIVING I/O VL_ VL = 1.8V CIOVCC = 15pF 2.0 2.5 3.0 3.5 4.0
10 DRIVING I/O VL_ VL = 1.8V CIOVCC = 15pF 2.0 2.5 3.0 3.5 4.0
0.2
5
0 VCC SUPPLY VOLTAGE (V)
0 4.0 VCC SUPPLY VOLTAGE (V) VCC SUPPLY VOLTAGE (V)
VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX13013 toc04
VL SUPPLY CURRENT vs. TEMPERATURE
MAX13013 toc05
VCC SUPPLY CURRENT vs. TEMPERATURE
DRIVING I/O VCC_ CIOVL = 15pF
MAX13013 toc06
25
4.0
16 15 VCC SUPPLY CURRENT (mA) 14 13 12 11 10
VCC SUPPLY CURRENT (mA)
15
VL SUPPLY CURRENT (mA)
20
3.6
3.2
10 DRIVING I/O VL_ VL = 1.2V CIOVCC = 15pF 1.5 2.0 2.5 3.0 3.5 4.0
2.8
5
2.4
DRIVING I/O VCC_ CIOVL = 15pF -40 -15 10 35 60 85
0 VCC SUPPLY VOLTAGE (V)
2.0 TEMPERATURE (C)
-40
-15
10
35
60
85
TEMPERATURE (C)
VL SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O VCC_
MAX13013 toc07
VCC SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O VCC_
MAX13013 toc08
RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O VCC_
MAX13013 toc09
1.0
25
1.5
VCC SUPPLY CURRENT (mA)
VL SUPPLY CURRENT (mA)
0.8
22
1.2 RISE/FALL TIME (ns) tRISE 0.9
0.6
19
0.4
16
0.6 tFALL
0.2 DRIVING I/O VL_ 0 0 10 20 30 40 CAPACITIVE LOAD (pF)
13 DRIVING I/O VL_ 10 0 10 20 30 40 CAPACITIVE LOAD (pF)
0.3 DRIVING I/O VL_ 0 0 10 20 30 40 CAPACITIVE LOAD (pF)
_______________________________________________________________________________________
5
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013/MAX13014/MAX3023
Typical Operating Characteristics (continued)
(Data rate = 100Mbps, VCC = 3.3V, VL = 1.8V, TA = +25C, unless otherwise noted.)
RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O VL_
MAX13013 toc10
PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O VCC_
MAX13013 toc11
PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O VL_
DRIVING I/O VCC_ PROPAGATION DELAY (ns) 4
MAX13013 toc12
1.2 tRISE 1.0 RISE/FALL TIME (ns) 0.8 0.6 0.4 0.2 DRIVING I/O VCC_ 0 0 5 10 15 tFALL
5 DRIVING I/O VL_ PROPAGATION DELAY (ns) 4 tPLH
5
3
3 tPLH 2
2
1 tPHL 0 20 0 10 20 30 40 CAPACITIVE LOAD (pF) CAPACITIVE LOAD (pF)
1 tPHL 0 0 5 10 15 20 CAPACITIVE LOAD (pF)
tEN-VCC vs. TEMPERATURE (CIOVCC = 15pF)
MAX13013 toc13
tEN-VL vs. TEMPERATURE (CIOVL = 15pF)
MAX13013 toc14
TYPICAL I/O VL_ DRIVING (CIOVCC = 40pF)
MAX13013 toc15
250
100
230 tEN-VCC (ns)
80
2V/div tEN-VL (ns) 210 60
190
40
2V/div
170
20
150 -40 -15 10 35 60 85 TEMPERATURE (C)
0 -40 -15 10 35 60 85 4ns/div TEMPERATURE (C)
TYPICAL I/O VCC_ DRIVING (CIOVL = 15pF)
MAX13013 toc16
TYPICAL I/O VL_ DRIVING (VCC = 1.65V, VL = 1.2V, CIOVCC = 40pF)
MAX13013 toc17
TYPICAL I/O VCC_ DRIVING (VCC = 1.65V, VL = 1.2V, CIOVL = 15pF)
MAX13013 toc18
2V/div
1V/div
1V/div
2V/div
1V/div
1V/div
4ns/div
4ns/div
4ns/div
6
_______________________________________________________________________________________
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
Pin Description--MAX13013/MAX13014/ MAX3023 (Bidirectional Devices)
PIN MAX3023 TSSOP 1 2 3 4 5 6 7 4x3 UCSP A1 B2 A2 -- B3 A3 A4 MAX13013 SC70 4 -- 5 -- -- -- 6 3x2 UCSP B2 -- B1 -- -- -- B3 MAX13014 SOT23 7 6 8 -- -- -- 5 3x3 UCSP A2 A3 A1 -- -- -- B1 I/O VL1 I/O VL2 VL N.C. I/O VL3 I/O VL4 EN Input/Output 1, Referenced to VL Input/Output 2, Referenced to VL VL Input Voltage, +1.2V VL VCC - 0.4V. Bypass VL to GND with a 0.1F capacitor. No Connection Input/Output 3, Referenced to VL Input/Output 4, Referenced to VL Active-High Enable Input. If EN is pulled low, all inputs/outputs are in tristate. Drive EN high (VL) for normal operation. Active-Low Enable Input. If EN is pulled high (VL), all inputs/ outputs are in tri-state. Drive EN low for normal operation (MAX3023 TSSOP package only). Input/Output 4, Referenced to VCC Input/Output 3, Referenced to VCC Ground VCC Input Voltage, +1.65V VCC +3.6V. Bypass VCC to GND with a 0.1F capacitor. Input/Output 2, Referenced to VCC Input/Output 1, Referenced to VCC NAME FUNCTION
MAX13013/MAX13014/MAX3023
8 9 10 11 12 13 14
-- B4 C4 C3 C2 C1 B1
-- -- -- 2 1 -- 3
-- -- -- A3 A1 -- A2
-- -- -- 4 1 3 2
-- -- -- B3 C1 C3 C2
EN I/O VCC4 I/O VCC3 GND VCC I/O VCC2 I/O VCC1
_______________________________________________________________________________________
7
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013/MAX13014/MAX3023
Test Circuits/Timing Diagrams
tRISE/FALL 3ns
I/O VL_ VL VCC
90% 50% 10% I/OVL-VCC I/OVL-VCC
MAX13013
EN
I/O VL_
I/O VCC_ CIOVCC I/O VCC_ 90% 50%
SOURCE 10%
tFVCC
tRVCC
Figure 1. Driving I/O VL_ Test Circuit and Timing
tRISE/FALL 3ns
I/O VCC_ VL VCC
90% 50% 10% I/OVCC-VL I/OVCC-VL
MAX13013
EN
I/O VL_ CIOVL_
I/O VCC_ I/O VL_ SOURCE 90% 50% 10%
tFVL
tRVL
Figure 2. Driving I/O VCC_ Test Circuit and Timing
8
_______________________________________________________________________________________
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
Test Circuits/Timing Diagrams (continued)
EN VL
MAX13013/MAX13014/MAX3023
MAX13013
SOURCE I/O VL_ VL 1M CIOVCC I/O VCC_
EN
t'EN-VCC
0 VL 0 VCC
I/O VL_
I/O VCC_ VCC EN
VCC / 2
0
VL
MAX13013
SOURCE I/O VL_
1M
EN
t"EN-VCC
0 VL 0
I/O VCC_ CIOVCC
I/O VL_
I/O VCC_ VCC / 2
VCC 0
tEN-VCC IS WHICH EVER IS LARGER BETWEEN t'EN-VCC AND t"EN-VCC.
Figure 3. Propagation Delay from I/O VL_ to I/O VCC_ After EN
EN
VL
MAX13013
SOURCE I/O VCC_ VCC
EN
t'EN-VL
0 VCC 0
I/O VL_ 100k CIOVL
I/O VCC_
VL I/O VL_ VL / 2 0
EN VL SOURCE 100k I/O VCC_ I/O VL_ CIOVL I/O VL_ VL / 2 I/O VCC_
VL
MAX13013
EN
t"EN-VL
0 VCC 0 VL 0
tEN-VCC IS WHICH EVER IS LARGER BETWEEN t'EN-VCC AND t"EN-VCC.
Figure 4. Propagation Delay from I/O VCC_ to I/O VL_ After EN _______________________________________________________________________________________ 9
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013/MAX13014/MAX3023
Detailed Description
The MAX13013/MAX13014/MAX3023 logic-level translators provide the level shifting necessary to allow 100Mbps data transfer in a multivoltage system. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. Logic signals present on the VL side of the device appear as a highervoltage logic signal on the VCC side of the device, and vice-versa. The MAX13013/MAX13014/MAX3023 bidirectional level translators allow data translation in either direction (V L V CC ) on any single data line. The MAX13013/MAX13014/MAX3023 accept VL from +1.2V to (VCC - 0.4V) and operate with VCC from +1.65V to +3.6V, making them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems. When in tri-state mode, the MAX13013/MAX13014/ MAX3023 reduce the VCC supply current to 0.03A, and the V L supply current to 0.1A. These devices operate at a guaranteed data rate of 100Mbps for VL > 1.8V. For proper operation, ensure that +1.65V VCC +3.6V, and +1.2V V L V CC - 0.4V. During power-up sequencing, VL VCC does not damage the device. During power-supply sequencing, when VCC is floating and VL is powering up, up to 40mA current can be sourced to each load on the VL side, without the device latching up. The maximum data rate depends heavily on
VL I/O VL_ TO I/O VCC_ PATH P ONE-SHOT 4k I/O VL N ONE-SHOT I/O VCC
the load capacitance (see the Typical Operating Characteristics Rise/Fall Time graph), output impedance of the driver, and the operating voltage range (Table 1).
Input Driver Requirements
The MAX13013/MAX13014/MAX3023 architecture is based on a one-shot accelerator output stage (see Figure 5). Accelerator output stages are in tri-state mode except when there is a transition on any of the translators on the input side, either I/O VL_ or I/O VCC_. A short pulse is then generated during which the accelerator output stages become active and charge/discharge the capacitances at the I/Os. Due to the architecture, both sides become active during the oneshot pulse. This can lead to some current feeding into the external source that is driving the translator. However, this behavior simply helps to speed up the transition on the driven side. For proper operation, the driver has to meet the following conditions: less than 25 output impedance and greater than 20mA peak output current capability.
Level Translation
Table 1. Data Rate
VL (V) VL < 1.8 VL 1.8 GUARANTEED DATA RATE (Mbps) 80 100
VCC
P ONE-SHOT 150
N ONE-SHOT
I/O VCC_ TO I/O VL_ PATH
Figure 5. Simplified Functional Diagram (One I/O Line) 10 ______________________________________________________________________________________
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
Figure 6 shows a graph of typical input current versus input voltage.
MAX13013/MAX13014/MAX3023
Table 2. MAX3023 (TSSOP Package) Operating Mode
EN 0 VL 0 VL EN 0 0 VL VL OPERATING MODE Both I/O VL_ and I/O VCC_ are in tri-state. Normal operation. Both I/O VL_ and I/O VCC_ are in tri-state. Both I/O VL_ and I/O VCC_ are in tri-state.
Output Load Requirements
The MAX13013/MAX13014/MAX3023 I/O are designed to drive CMOS inputs. Do not load the I/O lines with a resistive load less than 25k. Also, do not place an RC circuit at the input of these devices to slow down the edges. If a slower rise/fall time is required, refer to the MAX3000E/MAX3001E logic-level-translators data sheet. For I 2 C level translation, refer to the MAX3372EMAX3379E/MAX3390E-MAX3393E data sheet.
Applications Information
Power-Supply Decoupling
To reduce ripple and the chance of introducing data errors, bypass V L and V CC to ground with a 0.1F ceramic capacitor. Place all capacitors as close to the power-supply inputs as possible.
Enable Inputs
The MAX13013 single-, the MAX13014 dual- and the MAX3023 (UCSP package) quad-level translators feature an EN input. The MAX3023 (TSSOP package) quad-level translator features both EN and EN inputs (see Table 2 for operating mode). Note that the MAX3023 (TSSOP package) has internal pullup and pulldown circuitry on EN and EN, respectively. If left unconnected, EN is pulled up to VL and EN is pulled down to GND.
Unidirectional vs. Bidirectional Level Translator
The MAX13013/MAX13014/MAX3023 bidirectional translators can operate as a unidirectional device to translate signals without inversion. These devices provide the smallest solution (UCSP package) for unidirectional level translation without inversion.
IIN
UCSP Applications Information
For the latest application details on UCSP construction, dimensions, tape carrier information, PC board techniques, bump-pad layout, and recommended reflow temperature profiles, as well as the latest information on reliability testing results, go to Maxim's web site at www.maxim-ic.com/ucsp to find the Application Note: UCSP--A Wafer-Level Chip-Scale Package.
VIN VTH_IN
VTH_IN / RIN*
0
-(VS - VTH_IN) / RIN*
VS WHERE VS = VCC OR VL
*RIN = 4k WHEN DRIVING VL SIDE; RIN = 150 WHEN DRIVING VCC SIDE.
Figure 6. Typical IIN vs. VIN
Purchase of I2C components from Maxim Integrated Products, Inc. or one of its sublicensed Associated Companies, conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. ______________________________________________________________________________________ 11
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013/MAX13014/MAX3023
Pin Configurations (continued)
1 2 3
TOP VIEW
VCC 1 8 7 6 5 VL I/O VL1 I/O VL2 EN B EN C VCC I/O VCC1 I/O VCC2 A VL I/O VL1 I/O VL2 I/O VCC1 2 I/O VCC2 3
MAX13014
GND
GND 4
MAX13014 SOT23
UCSP (BUMPS ON BOTTOM OF DIE)
1 2 3 4
TOP VIEW
I/O VL1 1 I/O VL2 VL 2 3 14 I/O VCC1 13 I/O VCC2 12 VCC
MAX3023
A I/O VL1 B I/O VCC1 C I/O VCC2 VCC GND I/O VCC3 I/O VL2 I/O VL3 I/O VCC4 VL I/O VL4 EN
N.C. 4 I/O VL3 5 I/O VL4 6 EN 7
MAX3023
11 GND 10 I/O VCC3 9 8 I/O VCC4 EN
TSSOP
UCSP (BUMPS ON BOTTOM OF DIE)
Ordering Information/Selector Guide (continued)
PART MAX13013EBT-T MAX13014EKA MAX13014EBL-T MAX3023EUD MAX3023EBC-T TEMP RANGE -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C PIN-PACKAGE 3 x 2 UCSP-6 8 SOT23 3 x 3 UCSP-9 14 TSSOP 4 x 3 UCSP-12 PACKAGE CODE B6-1 -- B9-2 -- B12-1 TOP MARK ADF AEKB AEN -- ABW NUMBER OF VL VCC TRANSLATORS 1 2 2 4 4 Number of VCC VL TRANSLATORS 1 2 2 4 4 EN EN -- -- -- --
Chip Information
TRANSISTOR COUNT: MAX13013: 261 MAX13014: 444 MAX3023: 791 PROCESS: BiCMOS
12 ______________________________________________________________________________________
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
SC70, 6L.EPS
MAX13013/MAX13014/MAX3023
PACKAGE OUTLINE, 6L SC70
21-0077
C
1
1
______________________________________________________________________________________
13
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013/MAX13014/MAX3023
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
6L, UCSP.EPS
PACKAGE OUTLINE, 3x2 UCSP 21-0097 G
1 1
14
______________________________________________________________________________________
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
SOT23, 8L .EPS
MAX13013/MAX13014/MAX3023
SEE DETAIL "A" b e
C L
SYMBOL A A1 A2 b C D E E1 L L2 e e1
MIN 0.90 0.00 0.90 0.28 0.09 2.80 2.60 1.50 0.30
MAX 1.45 0.15 1.30 0.45 0.20 3.00 3.00 1.75 0.60 0.25 BSC.
C L
E
C L
E1
PIN 1 I.D. DOT (SEE NOTE 6) e1 D C
C L
0
0.65 BSC. 1.95 REF. 0 8
L2 A A2 A1
SEATING PLANE C
GAUGE PLANE
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF HEEL OF THE LEAD PARALLEL TO SEATING PLANE C. 3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR. 4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING. 5. COPLANARITY 4 MILS. MAX. 6. PIN 1 I.D. DOT IS 0.3 MM y MIN. LOCATED ABOVE PIN 1. 7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP. 8. MEETS JEDEC MO178.
L
0
DETAIL "A"
PROPRIETARY INFORMATION TITLE:
PACKAGE OUTLINE, SOT-23, 8L BODY
APPROVAL DOCUMENT CONTROL NO. REV.
21-0078
D
1 1
______________________________________________________________________________________
15
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013/MAX13014/MAX3023
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
9LUCSP, 3x3.EPS
PACKAGE OUTLINE, 3x3 UCSP 21-0093 I
1 1
16
______________________________________________________________________________________
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
TSSOP4.40mm.EPS
MAX13013/MAX13014/MAX3023
______________________________________________________________________________________
17
+1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13013/MAX13014/MAX3023
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
12L, UCSP 4x3.EPS
PACKAGE OUTLINE, 4x3 UCSP 21-0104 F
1 1
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
18 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.

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